Emerson Network Power will build a data center research space in Ohio to advance research and product development of data center thermal management technologies and controls. The 38,500 square-foot Emerson Innovation Center, also known as “The Helix,” is slated to open on the University of Dayton campus in late 2015. The R&D space will expand the ability of Emerson Network Power’s Thermal Management business to deliver more holistic, next generation approaches to controlling the data center environment and managing heat, according to the company. Emerson Network Power engineers will collaborate with university researchers and students to develop and better understand intelligent and versatile cooling technologies and controls that improve energy efficiency, maximize free cooling and protect mission critical applications.
The data center research space will contain a variety of thermal management technologies, including the new Liebert DSE cooling system with pumped refrigerant economization technology and the Liebert iCOM intelligent control technology. Emerson engineers will initially use the facility to advance technology development in areas including advanced controls, energy efficiency gains using free cooling and next generation component technology.
When completed, the $35 million Emerson Innovation Center will employ 30 to 50 people and focus on five HVACR industry markets, each with its own research module: supermarket refrigeration, food service operations, residential connected homes, data center cooling and light commercial buildings. The innovation center’s five research modules will facilitate collaboration between Emerson and the University of Dayton’s School of Engineering.
For more information, visit www.EmersonNetworkPower.com