Dow Corning Introduces Strong Assembly Sealant

Jan 28, 2009

Formulated for automated assembly, new Dow Corning HM-2520 Assembly Sealant is said to combine the strength of a hot melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load. 
 
HM-2520 Assembly Sealant is a neutral-cure, low VOC sealant that enables parts to be moved immediately upon application.  It also offers higher tensile strength for applications that require more secure adhesion, according to the company.
 
HM-2520 Assembly Sealant maintains excellent adhesion to most common substrates.  It has a high tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C).  This product meets FDA Regulation CFR 177.2600 and is NSF 51 and NSF 61 listed.
 
For more information, visit: http://www.dowcorning.com.

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